비전 검사 시스템 | HITS 에이치아이티에스

Vision Inspection System 장비

• Human Error Auto Detection
• Human Error Auto Detect System: At Semiconductor Module Packing Process, Vision inspection and Sorting System that prevent the mistake and quality accident by human works such as module insertion into tray, module label attachment, etc. / Applicable to Semiconductor Module / OCV Vision Inspection on Tray Cap Label / Direct 1D/2D Barcode Scan on module in tray / Separation & Assembly Function on Tray & Cap / Desiccant & Pink Foam Insertion Function with position check by Vision / Composition : Module Tray Loading, Module Tray Loading Buffer, OCV Vision, / Separation PnP, Human Error Inspection, Reject Port, Desiccant/Pink Foam Insertion, / Assembly PnP, Module Tray Unloading Buffer, Module Tray Unloading
• IR Crack
• IR Crack Inspection System: System that inspects a crack, chipping, etc. on pattern side of Flip chip and provides mapping on detected NG by NIR/SWIR camera / Applicable to 74, 95mm FCBGA Substrate, FCCSP, FCSiP / Customized by Substrate, JIG, Boat / Customized by NIR or SWIR camera / Application of Deep Learning Algorithm to reduce overkill / Mapping & Review Function for verification on detected NG / Composition : M/Z Loading, Barcode Scan, Guide Rail, Transfer, / Vacuum Table, Vision Inspection, M/Z Unloading
• W/B, D/A
• W/B, D/A AVI System: After Wire Bonding Process, System that inspects the external appearance of Ball/Wire and Stitch / Applicable to FCBGA Substrate / Deep Learning Algorithm, Review Function for verification / 29M High Resolution camera / Accuracy : 1.8um / Provide various statistical data by NG type / Inspection / Wire connecting status, Stitch, Ball Attachment Status / Composition : Magazine Loading/Unloading, Buffer Rail, Gripper PnP, / Vibration free super precision state, Porous Chuck Table,3D Vision Inspection
• W/B, D/A 3D AVI System: System that measures bonding path of wire after wire bonding process / Possible to measure loop of stack device / Measurement Repeatability : ±1um / Excellent Expandability on Measurement Area / Dual Vision Inspection Lane for 2D & 3D / Deep Learning Algorithm, Review Function for verification / Inspection Item / 2D W/B : Ball Lifted, Size, Placement, Off center, Broken wire, wire to wire distance, etc. / 2D D/A : Chip crack, Die position(No die, Die O/T),Pad Abnormal(Probe Mark), Film Shift / Common, Sub Defect, Die Scratch / 3D : Loop & Edge Height, Sub Height, Die Height / Composition : Magazine Loading/Unloading, Buffer Rail, Gripper PnP, / Dual Vibration free super precision state, Porous Chuck Table, / 2D Vision Inspection, 3D Vision Inspection
• W/B, D/A – 3D Optical Inspection System: After Wire Bonding Process, System that inspects the external appearance of Ball/Wire and Stitch / Applicable to FCBGA Substrate / Deep Learning Algorithm, Review Function for verification / 29M High Resolution camera / Accuracy : 1.8um / Provide various statistical data by NG type / Inspection / Wire connecting status, Stitch, Ball Attachment Status / Composition : Magazine Loading/Unloading, Buffer Rail, Gripper PnP, / Vibration free super precision state, Porous Chuck Table, 3D Vision Inspection
• Package Inspection
• PKG Inspection System: System that inspects Marking, Mold Surface, Ball Land after Marking process for super thin type semiconductor package / Applicable to FCBGA Substrate / Inspection on the front and back side surface of substrate / Accuracy : 10um / Inspection Item / Mold : Chip out, Incomplete mold, Void hole, Bubble, Porosity, Crack Sticking, Scratch / Marking : Illegible Mark, Double Mark, Incorrect orientation, Wrong Mark, Misplace Mark, No Mark / Ball Land : Cu Exposure, Scratch, Contamination, Foreign Material, Sub Broken/Pressed / Composition : M/Z Loading, Transfer Rail, Top Vision Inspection, Btm Vision Inspection, M/Z Unloading
• Mold
• Mold Inspection System: System that inspects the external appearance of Mold / Applicable to FCBGA Substrate / Provide various statistical data by NG type / Flying High Speed Inspection / View function to observe and measure precisely / (Detail observation up to 1Pixel) / Accuracy : Over 20um / Inspection Item / Pin-Hole, Incomplete, S/C, Exposure, FM, etc. / Composition : M/Z Loading, Transfer Rail, Vision Inspection, M/Z Unloading
• Mold Side Thickness & Surface Inspection System: System that inspects the lateral appearance of Semiconductor PKG Mold / Provide various statistical data by NG type / PKG Alignment by Align Vision (Resolution : 26um/pixel) / Inspection Resolution : 2um / Accuracy : 5um / Inspection Item / Thickness, Crack, Void by 3-point measurement / Composition : Tray Loading, PKG PnP, Alignment Vision Inspection, / Vision Inspection, Tray Unloading
• LED External Appearance
• LED External Appearance Inspection System(mold): System that inspects the external appearance on Die, Zener, Wire Bonding of LED Lead Frame after wire bonding or Reject items after dispensing / Applicable to Lead Frame for LED / Provide various statistical data by NG type / 16M Camera(Resolution : 6um) / Laser Marking on detected NG Device / Inspection Item / FM, Ball Shift, No Bump, Double Wire, Missing Wire, Zener inspection, etc. / Composition : M/Z Loading, Transfer Rail, Vision Inspection, Laser Marking, M/Z Unloading
• Panel Film Defect
• Panel Film Defect Inspection System: System that inspects FM, Scratch, Bubble, Dig, etc. with Film Cleaning Process on Processed Panel Film Material / Applicable to Polarizer Film / Good / Reject Sorting Function / Ink Marking for Reject Position / Provide various statistical data by NG type / Review Function for Reject Film / 16K Camera(Resolution : 3.5um) / Inspection Item / FM > 30um, Scratch width > 30um, Bubble > 30um, Dig > 30um / Composition : Loading Conveyor, Film Cleaning, Film Drying, Vision Inspection, / Ink Marking, Sorting, Unloading Conveyor
• Damaged Pixel
• Damaged Pixel Inspection System: System that inspects the damaged pixel coordinate on the Panel / Applicable to small & medium or High resolution LCD Panel, etc. / helps Laser Repair equipment to find out the location of bad product and repair it / When NG is detected, trigger an alarm / 12K Camera(Resolution : 6um) / Accuracy : 6um / Composition : Stand-alone type to place A/P on the coordinate measuring equipment
• Glass Surface
• Glass Surface Inspection System: System that inspects the defect by getting and processing the live video pictures from the Panel on the moving conveyor / Applicable to small & medium or High resolution LCD Panel, etc. / 12K Linescan Camera(Resolution : 10um) / Accuracy : ±10um / Inspection Item / Burr/Crack/Bubble
• LCD Panel
• Edge Inspection System: Inline Inspection System that inspects the quality of Glass edge and Cutting dimension after Scribing process / Applicable to LCD Panel, etc. / 2K~8K Linescan Camera(Resolution : 10um) / Inspection Item & Accuracy / Burr : 50um / Broken : 50um / Chip : 50um / Dim. : 50um
• Edge Grinder Inspection System: System that aligns LCD before grinding and measures the grinded upper/lower side and the edge of Panel after grinding automatically by vision system / Applicable to LCD Panel, etc / Save the inspection result and analyze the cause of the bad product / Process time / Alignment : image grab 80ms / image analysis 100ms / Measurement : image grab 80ms / image analysis 120ms / Camera Resolution / Alignment : XGA Class / Measurement : VGA Class / Accuracy : 3um / Inspection Item / Measure Grinding value on the upper and lower side of Pad / Measure Grinding value on the lower side of Non Pad / Measure the upper and lower side of Grinding simultaneously / Measure Grinding value on the upper and edge part of Non Pad
• Secondary Cell Battery
• Secondary Cell Battery Plate Inspection System: System that inspects Cutting condition and divides the defects such as Burr, Dross, etc. and analyze the cause of defect during producing battery plates / Applicable to Secondary Cell Battery plate / Process time / 420ms / frame / 6000 x 256 Camera Resolution(Resolution : 10um) / Inspection Item / Burr : 50um / Dross : 50um
• Secondary Cell Battery Bus Bar Inspection System: System that inspects the welding and external appearance condition of bus bar, inspects its insertion condition and divide Good/NG with analyzing its cause during producing battery module / Applicable to Secondary Cell Battery Bus Bar / Process time / Image grab : 80ms / Image analysis : 160ms / 2448 x 2048 Camera Resolution(Resolution : 20um) / Inspection Item / Welding width, Lead width, Cell Insertion

공식 연락처

(주)에이치아이티에스 본사/기술연구소/공장

경기도 부천시 부일로 809번길 81 히트비젼타워 4층

전화 (+82)-2-2066-3890

이메일 hitssales@highimage.co.kr